Products

Process Capability

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Keep improving our quality by the quick responses from customer end
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Min. Trace Withh/Space: Inner Layer: 3/3mil (75/75μm)
Outer Layer: 3/3mil (75/75μm)
Smallest Via Hole: Mechanical Drilling: 6mil (150μm)
Board Thickness: Min. Thickness: 16 mil (0.4mm)
Max. Thickness: 157mil (4mm)
Surface Finish: OSP, HSAL, Immersion Gold, Lead free HASL Immersion Silver, Immersion Tin, Carbon Ink , Peelable mask
Impedance Control: Single & Differential IP: +/-10%
Board Warpage Control: +/-0.7%
Heavy Copper : 4/4 oz Quickturn, Prototype , Mass production RoHS
Material : FR-4 , Aluminum Board , TG140 , TG170 , TG180
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