製程能力
品質政策
掌握關鍵細節．提供優質服務
| Min. Trace Withh/Space: | Inner Layer: 3/3mil (75/75μm) Outer Layer: 3/3mil (75/75μm) |
|---|---|
| Smallest Via Hole: | Mechanical Drilling: 6mil (150μm) |
| Board Thickness: | Min. Thickness: 16 mil (0.4mm) Max. Thickness: 157mil (4mm) |
| Surface Finish: | OSP, HSAL, Immersion Gold, Lead free HASL Immersion Silver, Immersion Tin, Carbon Ink , Peelable mask |
| Impedance Control: | Single & Differential IP: +/-10% |
| Board Warpage Control: | +/-0.7% |
| Heavy Copper : | 4/4 oz Quickturn, Prototype , Mass production RoHS |
| Material : | FR-4 , Aluminum Board , TG140 , TG170 , TG180 |